Webinar: MEMS Vacuum Packaging

This webinar focuses on vacuum packaging technologies for a variety of MEMS devices. These include traditional metal and ceramic packages as well as numerous wafer-to-wafer bonding techniques. MEMS processing methods including wafer preparation, etching, and getter incorporation are discussed, as well as a number of MEMS applications requiring vacuum packaging.

Topics include:
* discrete packages used for vacuum applications
* wafer-to-wafer bonding and related MEMS processing
* getter incorporation
* applications such as MEMS gyroscopes, fluidic sensors, RF MEMS and pressure sensors