Contactless residual solder removal in one sweep: After starting a reflow process, molten solder is easily removed from the board with powerful vacuum. The new generation of solder removal heads allow contactless residual solder removal without any disturbing pads or solder resist.
As the solder has been removed in a nitrogen atmosphere, contamination of the solder is minimized, surface tension effects reduced, and a smooth spherical solder residue is left - making for a cleaner solder removal step without residual solder forming a meniscus ("chocolate kiss").
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