Describes how to convert a cavity ball grid array designed in SIP which contains two stacked die and several dielectric layers with cutouts into a 3D model in AutoCAD Inventor. The process starts by exporting a 3Di file from SIP. Then the 3Di is converted into STEP using Artwork's 3Di2STEP software. Finally the STEP is imported into AutoCAD Inventor. The entire process takes less than a minute and results in an organized 3D model in Inventor.