This describes a new tool in Artwork's 3DVU that can separate out discrete objects and solder bumps to separate them from the conductor layer. When Cadence SIP outputs 3Di, it puts the discretes and solder balls and the same layer as the conductor that they attach to. This is not what is wanted when converting 3Di into a 3D format such as SolidWorks or STEP. The new Layer Object Filter is able to separate these based on their object tag and create separate layers.
