Here is the video for weSRCH:Rick Hill of Novellus(chairman & CEO).
In this interview we delve into what’s new in packaging and how their new products help chip makers drive down costs and raise yields. Novellus recently introduced a complete line of new products that address longstanding issues in TSV, such as heavy electrofill overburdens that slow down CMP and drive up costs. Rick talks not only about how Novellus is striving to eliminate CMP, which is not a value added step, but also about how the company’s newest systems help to reduce voids and defects.
visit the weSRCH editorial for more details wesrch.com/weqEL1LV5A
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