ADHESIVES / COATINGS / ENCAPSULANTS >>> SMT 256B
YINCAE created the world's FIRST solder joint encapsulant adhesive that can be used for enhancement of the solder joint and replaces underfill.
SMT 256B is a highly sophisticated formulation designed for mass production by dipping, printing, or dispensing. It improves the solder joint strength by 5-10 times, has excellent thermal cycling performance, and increases process yield.
It is compatible with typical lead-free solder paste and has excellent stability at room temperature, allowing for longer shelf life.