Advanced Techniques in Electrical, Electronic and Electro-mechanical (EEE) components Testing.
- Material Analysis
- 3D X-Ray Inspection
- XPS - X-ray Photoelectron Spectroscopy
- TEM - Transmission Electron Microscopy
- SEM/FIB - Scanning Electron Microscopy / Focused Ion Beam
- Accelarate Life Testing
Only the most advanced techniques are able to provide the depth and accuracy in the inspections required by current state of the art microelectronics.
Determining the root cause of a failure requires advanced techniques employed to detect the origin of the observed failure mechanism.