The second annual AI Hardware Summit took place in Silicon Valley, September 17 - 18 2019, hosting the critical mass of the global industry to promote innovation and adoption of silicon and systems.
Luminary speakers included; John L. Hennessy, Chairman of Alphabet, Naveen Rao, CVP & GM, AI Products Group, Intel and Lip Bu-Tan, CEO, Cadence Design Systems and Chairman, Walden International.
Over 500 CTOs and CEOs were in attendance from companies such as: Intel AI, Flex Logix, Groq, Sambanova, Synopsys, Ansys, GrAI Matter Labs, Qualcomm, Vicor, Rambus, Kalray, Habana Labs, Mentor, Microsoft, Crossbar, Imagination Technologies, Cadence Design Systems, eSilicon, Lambda, Samtec, Mythic, NGD Systems, Real Intent, Lightelligence, Inno-logic, Flexential, Google, Cisco, Amazon, Samsung, Xilinx, Uber, IBM, Apple, Dell and more.
Headline Media Partner HPC Wire and Enterprise AI, along with Forbes, EETimes, Venturebeat,Tractica, EE Journal, IEEE and Arete Research all produced articles covering the Summit. Check out their websites for more information or view the Highlights report on the Summit website.
Interested in attending 2020?
Secure your ticket and view the highlights report: aihardwaresummit.com
Attend the European Summit by visiting: aihardwaresummiteu.com