Samtec’s product line includes two interconnects that offer Direct Connect Technology: FireFly™ and Si-Fly™. These interconnects are able to directly connect to the IC package, elude the BGA and route signals from the silicon through a long-reach cable. Aggregate data rates of 25.6 TB, with a path to 51.2 TB, are possible due to the high-density design. FireFly™ is available now, with lanes speeds up to 56 Gbps PAM4. Si-Fly™ is in development (available 2020), with lanes speeds capable of 112 Gbps PAM4 and beyond.