Intel Advanced Packaging in New Mexico’s Fab 9, Manufacturing in Fab 11X (B-Roll)

Video footage from January 2024 shows Intel New Mexico’s Fab 9 and Fab 11X in Rio Rancho. In January 2024, Intel celebrated the opening of Fab 9, part of the company’s previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies. The Fab 9 and Fab 11X facilities represent the first operational site for mass production of Intel’s Foveros 3D advanced packaging technology. The site is also Intel's first co-located high-volume advanced packaging site, marking an end-to-end manufacturing process and allowing for a more efficient supply chain from demand to final product. (Credit: Intel Corporation)