1. EUV EIP (EUV Inner Pod) AMC decontamination System.
    With one EUV Pod load port, GUI, 6 Axis robot and high vacuum chamber with optional RGA.
    Operator loads the pod on the load port and selects recipe form move in the EUV inner pod.
    Load port removes the bottom plate to allow the robot to pick the complete inner pod.
    At the same time the vacuum chamber is opening fully automated and the robot loads the vacuum chamber.
    Do is closing and chamber is locked.
    Decontamination process time can be individually adjusted.
    System is fully encapsulated and works with a recirculated Filter Fan system with N2 or XCDA purge.
    AMC filtration can be offered as an option.

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  2. High end FOUP cleaning with integrated vacuum decontamination for airborne molecular contamination removal.
    Tool can manually loaded or via OHT system.
    On demand cleaning
    Different configurations for different t-put requirements.
    Optional integrated FOUP Inspection system.
    Optional Surfactant supply
    High efficient washing process based DI water spray nozzles supported with N2 while product is slowly rotated for state of the art particle perfromance
    Drying is a combination of Hot clean CDA and IR lamps.
    Patented dry purge system integrated to cleaning chambers for best snorkel dryness.
    Patented lid dry clean system for lid inside cleaning.
    Vacuum decontamination after wet/dry process supported by IR lamps for AMC control
    Optional N2 purge on OHT loaded port for lowest FOUP humidity

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  3. Cleaning of each EUV and RSP200 pod.
    Best particle cleaning,
    AMC cleaning with high vacuum chambers
    RGA’s for integrated Metrology
    Pod is loaded to load port at the unclean side.
    Robot takes the pod and starts the disassembly process
    Each pod part is treated in an individual chamber (total four)
    Unclean handling area has ISO 2 environment
    Pods are taken from disassembly station.
    One gripper for all pod parts.
    EIP parts are treated with Megasonic nozzles.
    Washing is combination of Hot DI water combined with N2
    Drying of each part is done be hot cleaned air and IR lamps.
    Pod are removed on the clean side of the equipment by a second robot.
    This are is N2 purged and recirculated.
    Pods are moved to the Vacuum chambers after washing for AMC decontamination.
    Optionally RGA’s can be connected for insitu metrology.
    After the vacuum process the pods are assembly and moved to the buffer or load port.

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  4. Fully automated FOUP cleaning combined with high flexibility manual cleaning
    Batch process of 8 FOUP per cleaning chamber.
    Two cleaning chambers max.
    Washing is done by DI water supported with N2
    Drying combination of spinning and IR lamps.
    Manual and OHT loading available.
    Cleaning chamber can be set to manual mode for cleaning of different products (i.e. RSP, clampshells, etc.)

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  5. The M450 fully-automatic 450mm FOUP/MAC cleaner combines best particle and AMC cleaning performance and provides humidity control.

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Semiconductor Contamination Control

Brooks Automation PRO

Semiconductor cleaning equipment, clean storage, wafer carriers and boxes and reticle handling.

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